CHAMP-XD3 High-Performance Processor Card

3U VPX INTEL ICE LAKE XEON D-1700 PROCESSOR CARD

For Digital Signal Processing, HPEC, Cognitive DSP, AI & Machine Learning

For highly compute-intensive industrial, aerospace, and defense applications, the CHAMP-XD3 processor card provides Trusted Computing features alongside leading-edge processing technology for unmatched performance.

• High-Performance Embedded Computing Processing
• Proven Foundation for Machine Learning
• Strengthened Security Capabilities
• Support for Today’s Leading Open Standards including the SOSA™ Technical Standard

This high-performance module, designed for the rigors of digital signal processing (DSP) and emerging machine learning and artificial intelligence applications, delivers incredible processing capability through its 10-core Intel "Ice Lake" Xeon D-1700 processor. The board includes a core function Xilinx Zynq® UltraScale+™ MPSoC FPGA with additional security and Arm co-processing cores for critical board functions and general purpose I/O, and includes a dedicated Intelligent Platform Management Interface (IPMI) for system monitoring and health.

Bring new levels of performance to your ISR and EW systems with the CHAMP-XD3:

High-Performance Processing

The CHAMP-XD3 combines the high core count and floating-point performance of the latest Intel 10th Gen “Ice Lake” Xeon D-1700 processors with the substantial bandwidth and system-enabling features of the VITA 3U OpenVPX form-factor. Providing an extended temperature Intel "Ice Lake" Xeon D-1700 LCC processor with 10 cores, the CHAMP-XD3 brings Intel’s new AVX512 floating-point capability to the rugged embedded marketplace. This is coupled with 48 GB of high capacity DDR4-2400 with a bandwidth of >19 GBps per channel with three channels per processor. The extra memory bank and speed provide over 50% more memory bandwidth than prior generation modules ensuring memory accesses are not a bottleneck.

Support for Today's Leading Open Standards

The CHAMP-XD3 offers variants to support your specific requirements, including models developed in alignment with the SOSA Technical Standard. The CHAMP-XD3 supports a 40GbE Data Plane, dual 10 GbE interfaces, and up to 16 lanes of Gen3 PCI Express® (PCIe) on the Expansion Plane. (Contact factory for Gen4 speeds.)

Strengthened Security Capabilities

The CHAMP-XD3 is part of Curtiss-Wright’s TrustedCOTS portfolio, offering built-in a Xilinx Zynq® UltraScale+™ MPSoC FPGA with additional security and embedded dual-core Arm A53 processor and dual-core R5 processor. In addition, the Ice Lake D-1700 processor brings new security capabilities to the Xeon D-1700 processor line, including Total Memory Encryption (TME), Software Guard Extensions (SGX), and Bootguard.