LVDS-MOD5 52x LVDS module
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- Low Voltage Differential Signalling (LVDS) - PMC Front Panel Mezzanine Module
- Up to 52 differential pairs
- Up to 104 single-ended signals
- Two 80-way front panel connectors
- Designed for use with PMC-FPGA05 product
- Windows, VxWorks and Linux host PMC support
The LVDS-MOD3 is a front panel mezzanine module designed to provide LVDS I/O functionality to Curtiss-Wright's FPGA-based processing PMC modules. This LVDS I/O module provides 32 differential pairs...
The LVDS-MOD4 is a front panel mezzanine module designed to provide LVDS I/O functionality to Curtiss-Wright Xilinx Virtex II-Pro and Virtex-5 FPGA-based processing PMC modules, the PMC-FPGA03,...
The PMC-FPGA05 is a commercial grade Xilinx Virtex-5 LX110 or LX155 FPGA based PMC module offers high-speed, customizable data I/O and PCI-X interface to the host computer. The FPGA is boosted by...
The XMC-FPGA05D high density I/O module controlled by a user programmable Xilinx Virtex-5 FPGA and supported by a range of front panel I/O modules including analog I/O, RS-485/422, LVDS and Camera...
The LVDS-MOD5 high density LVDS I/O module offers the benefits of simplified cable connectivity by using two digital I/O headers suitable for ribbon cables. The LVDS-MOD5 LVDS I/O module can be used for a mixture of 2.5V and 3.3V input and output signals depending upon the VCCO settings on the FPGA on any particular I/O bank. The LVDS-MOD5 LVDS I/O module provides two 80 way ERNI IDC front panel connectors, each supporting 26 differential pairs (each pair can be used as two single ended signals). This makes connection to the module straightforward through the use of standard ribbon cables. All impedances, data flow and timing are defined by the host FPGA for flexibility. Because the LVDS-MOD5 LVDS I/O module connects directly to the PMC-FPGA03, PMC-FPGA05, or XMC-FPGA05D host card's Xilinx Virtex FPGA, it removes bottlenecks and provides for a highly integrated processing solution.
The LVDS-MOD5 is one of a family of LVDS or direct digital I/O modules offering different I/O densities and connector types to suit the application needs. Other modules include 32x differential pairs (LVDS-MOD3) and 64x differential pairs (LVDS-MOD4).
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